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High-Resolution Digital Radiography Solutions

PiX Rainier CT

Ideal for High-Precision Inspection & Non-Destructive Testing Across Industries

PiX Rainier CT: Precision X-ray Imaging by Pacific NDT

Developed and manufactured by Pacific NDT, the PiX Rainier CT system brings together cutting-edge detector technology and a powerful microfocus X-ray source with a 5 µm focal spot to deliver unmatched clarity and precision.

By combining true micron-level resolution, rapid scan capability, and flexible system design, PiX Rainier CT is built to exceed the expectations of modern research labs, engineering teams, and production quality control environments.

Whether you are analyzing complex materials, inspecting electronic assemblies, or ensuring product integrity, PiX Rainier CT provides the clarity, speed, and reliability you need to make confident decisions.

Designed in the Pacific Northwest and fully assembled in the United States, ensuring the highest standards of engineering excellence and long-term support.

50 µm pixel pitch

Flexible 2x2 binning
mode

High frame rates

Manufactured
in USA

Product Details

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PiX Rainier CT: Precision X-ray Imaging by Pacific NDT

Developed and manufactured by Pacific NDT, the PiX Rainier CT system brings together cutting-edge detector technology and a powerful microfocus X-ray source with a 5 µm focal spot to deliver unmatched clarity and precision.

By combining true micron-level resolution, rapid scan capability, and flexible system design, PiX Rainier CT is built to exceed the expectations of modern research labs, engineering teams, and production quality control environments.

Whether you are analyzing complex materials, inspecting electronic assemblies, or ensuring product integrity, PiX Rainier CT provides the clarity, speed, and reliability you need to make confident decisions.

Designed in the Pacific Northwest and fully assembled in the United States, ensuring the highest standards of engineering excellence and long-term support.

The PiX Rainier CT system delivers advanced 3D imaging for fast, accurate analysis. Its 3D Reconstruction Engine converts 2D X-ray projections into high-resolution 3D volumes using filtered back projection (FBP) and iterative methods. Built-in artifact correction handles beam hardening, ring suppression, and noise reduction. Visualization & Display Modes include volume rendering, surface models, and orthoslices, with multi-volume support and wide-screen reference views.

Interactive Slice Tools like XY-XZ-YZ reslicers, ROI-based and radial reslicers, and 2D-to-3D surface plotting enable in-depth inspection. Object Control & Attributes offer customizable color maps, transparency, and annotation settings. Animation & Export features allow 360° view recordings and export in MP4, GIF, or AVI. Large file handling and CAD export in STL, ASCII, and STL Binary are supported. An intuitive View Management interface simplifies navigation while displaying live data for real-time evaluation.

  • High-precision inspection of electronic components such as solder joints, PCB assemblies, and microelectronics

  • Non-destructive evaluation of aerospace and defense components, including composites and turbine blades

  • Detailed analysis of automotive parts, including castings, AM parts, and safety-critical assemblies

  • Reliable testing of medical devices, implants, and surgical tools without damaging components

  • In-depth material characterization for R&D, including nanostructures and failure analysis

  • Accurate verification of internal features, porosity, and dimensional accuracy in additive manufacturing

Product Information

IP67 water- and dust-resistant

High-resolution 14"x17" X-Ray images
directly to your laptop

Includes a durable, lightweight, and
portable case or backpack

We offer drop protection

Video instructions
included

Assembled in USA

Durable housing

Damage resistant

Wired/Wireless system

Technical

Specifications

Brochure PiX 1417 HD

Download PDF brochure to know more
Product Model PiX Rainier CT
Technology a-Si TFT with Photodiode
Scintillator Gd2O2S:Tb(Gadox) or CsI
Pixel Matrix (Resolution) 3532 x 4302 pixels
Pixel Pitch 50 µm
Imaging Area Size (mm²) 353 x 430
Limiting Resolution (lp/mm) 5
A/D Conversion 16-bit
Trigger Mode 1.Software Trigger
2.Bluetooth Interfacing with X-ray
3.AED (Automatic Exposure Detection)
Input Voltage 12VDC,MAX 45W
Power Consumption(Max.) 1.Operating with Charging: 45 W
2.Operating (without charging): 20 W
Data Interface 1.1G-Ethernet
2.WiFi (802.11n/ac) 2×2 MIMO

PiX Rainier CT

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